Electronics Manufacturing Capabilities

Circuit board assembly capabilities and specifications

Circuit board assembly specifications

Surface Mount Technology (SMT), thru-hole components and mixed boards
SMT capabilities: JUKI KE2060E
Re-tape and reel (In-House): Yes
SMT placement machine feeder count: 100 x 8mm
Max component height: 15mm
Max component size: 140mmx73mm
Smallest pitch: 10mil
Max panel width: 405mm
Max Panel length: 560mm
Reflow oven : Manncorp CR4000-T
Reflow Oven Zone Count: 4 zone
ROHS Wave solder machine: Selective Wave EBSO SPA300
Screen/ Jet Printer Model: Ekra 40D
Automated Screen Printer Frame Sizes: (20x20 Frame), (23x23 Frame), (29x29 Frame)
MSL Control Devices (Baking/Seal/Storage): Yes
ISO-9001, AS-9100, IPC-A-610 G (Class II/III) and ROHS certified

Production processes

ISO trained Manufacture Engineering staff, SMT operators and production technicians
Engineering and software developers available for testing procedures or fixtures
Engineering microscopes: Ring light 2.25x / 5x magnification, Microscope 10x min magnification
Digital Oscilloscopes and Fluke multi-meters for troubleshooting
Visual inspections throughout build process
Customer supplied functionality tests
In-house development tests per customer specifications
Temperature and humidity environmental test chambers
Label printing capability: Yes
Label Printer Model: Zebra GK420D
Rework stations and ROHS Soldering Irons
Experienced technicians for hand placement parts and reworks
ISO-9001, AS-9100, IPC-A-610 G (Class II/III) and ROHS certified