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Electronics Contract Manufacturing
Capabilities Overview and Specifications
Circuit board assembly specifications
- Surface Mount Technology (SMT), thru-hole components and mixed boards
- SMT capabilities: JUKI KE2060E
- Re-tape and reel (In-House): Yes
- SMT placement machine feeder count: 100 x 8mm
- Max component height: 15mm
- Max component size: 140mmx73mm
- Smallest pitch: 10mil
- Max panel width: 405mm
- Max Panel length: 560mm
- Reflow oven : Manncorp CR4000-T
- Reflow Oven Zone Count: 4 zone
- ROHS Wave solder machine: Selective Wave EBSO SPA300
- Screen/ Jet Printer Model: Ekra 40D
- Automated Screen Printer Frame Sizes: (20x20 Frame), (23x23 Frame), (29x29 Frame)
- MSL Control Devices (Baking/Seal/Storage): Yes
- ISO-9001, AS-9100, IPC-A-610 G (Class II/III) and ROHS certified
Production processes
- ISO trained Manufacture Engineering staff, SMT operators and production technicians
- Engineering and software developers available for testing procedures or fixtures
- Engineering microscopes: Ring light 2.25x / 5x magnification, Microscope 10x min magnification
- Digital Oscilloscopes and Fluke multi-meters for troubleshooting
- Visual inspections throughout build process
- Customer supplied functionality tests
- In-house development tests per customer specifications
- Temperature and humidity environmental test chambers
- Label printing capability: Yes
- Label Printer Model: Zebra GK420D
- Rework stations and ROHS Soldering Irons
- Experienced technicians for hand placement parts and reworks
- ISO-9001, AS-9100, IPC-A-610 G (Class II/III) and ROHS certified
